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High Speed Dispenser for Glue and Solder

Automatic Dispensing of Adhesives and Solder paste.

Multi-dispensing Process: Encapsulation, Under Fill, Dam and Fill

Good board size 450mm x 450mm

PCB Size (Maximum) 450mm x 450mm
Dimensions (WxDxH mm) 91cm x 144cm x 151cm
Machine Weight(kg) 800Kg
PCB Size (Minimum) 50mm x 50mm
PCB Size (Optional) 60mm x 580mm

Fully Automatic High Speed SMT Adhesive Dispenser from DESEN the Q600 and Q600L.

The Q600 Dispenser is a perfect solution for SMT automatic dispensing and is a top class solution for both glue and solder dispensing as well as other adhesives.

Can be single or multiple heads for additional speed.

Key Points:

  • PCB Size Minimum:  50mm x 50mm
  • PCB Size Maximum: 450mm x 450mm
  • Dispensing Range: 300mm x 450mm (Single Valve)
  • Maximum Speed: 1000mm/s
  • Acceleration: 1.0G
  • Positional Accuracy: ±30um@3sigma(X,Y), ±20um@3sigma(Z)
  • Repeatable Positional Accuracy: ±15um@3sigma(X,Y) ,±5um@3sigma(Z)
  • Controllable Dispensing Commands: Point, Line. Multi- section line, Arc, Circle, Rectangle Filling, Circular Filling and 3D Dynamic Trajectory; Multi-dispensing Process: Encapsulation, Under Fill, Dam and Fill, SMA and Conductive Silver Epoxy, etc.
  • Multi Valves Available Can Be specified by Customer according to application

Options:

  • Laser height sensor
  • Product heating
  • Automatic weight calibration
  • Tilt & rotate  (Reduces Dispensing Range to 300mm x 450mm)
  • PCB Barcode scanning
  • MES Closed Loop
  • Dual Conveyor (1st & 4th Fixed),
  • 2 Segment Conveyor (Reduces PCB Size to 200 x 450mm)
  • 3 segment conveyor  (Reduces PCB Size to 200 x 450mm)
  • Q600L  Large Board machine - 

Large Board Option - Q600L

  •  Q600L Dispensing Range (With Tilt+Rotate): 440mm x 480mm
  • PCB Handling: 600mm x 580mm

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