HOME /3D Automatic optical Inspection (AOI) - Pemtron Athena

3D Automatic optical Inspection (AOI) - Pemtron Athena

Automatic In-Line 3D Automatic Optical Inspection solution from Pemtron.

100% height measurement, SPC Data, inspection using moire technology.

Vision Algorithm 3D PMP (Phase Measuring Profilometry) + 2D: Vision Inspection
Pixel Resolution 10um (15 & 18um optional)
Inspection Speed 20 cm²/ sec (speed dependant on chosen camera)
Field of View (FOV) 33mm x 30mm (other sizes available)
Inspection Height 27mm
Height Accuracy ±3%
PCB Size (Minimum) 50mm x 50mm
PCB Size (Maximum) 330mm x 330mm
PCB Size (Optional) 510mm x 510mm
PCB Thickness 0.4 ~ 7mm
Bottom Clearance 50mm

3D AOI Image from Pemtron 3D AOI Machine3D Automatic optical Inspection Machine from Pemtron

Advanced High Speed Inspection and Measurement Technology

Shadowless Phase Measuring Profilometry

Athena uses 12 Projector 3D AOI inspects 100% of the PCB in 2D and 3D. Combining the 2 technologies gives a complete optical inspection of a PCB shadow free and low false calls maintaining a high flexibility in system functionality.

  • 12 Projection + Three stage lighting
  • 2D and 3D simultaneous inspection algorithms
  • Telecentric Lens offers higher accuracy and detection
  • High Speed CPU and Image Processing
  • User Friendly Graphical Interface
  • Latest AI algorithms for automatic component identification
  • Built in Library Management System
  • Offline Real Time Debug Station (Optional)

High Speed Inspection Technology
The Athena High Speed Option inspects in 64cm sq. per sec. by utilizing an advanced network of more robust CPU.

High Component Inspection Technology
Athena can inspect components up to 27mm tall due to the updated and redesigned projectors.

Shadow Free 3D Technology
Eliminates shadow issues on highly populated PCBs and tall
components

Optical Character Recognition
Recognizes component part characteers by using color and
pattern algorithms. Ability to add & modify OCR font to optimize
inspection condition.

3D Solder & Height Measurement
Using our advanced 3D technology, Athena is able to take
inspection to levels that are limited by conventional 2D systems.
Adding solder height, volume and part co-planarity inspection
provides enhanced defect detection capabilities.

3D Lead Inspection
3D measurement algorithms enable the Athena to measure
lead height and volume of solder proving full-high quality
3D images.

Tilt & Rotate Measurement
Advanced algorithms can extract, detect and differentiate
diverse component body patterns automatically.

Features:
Board Size Min 50 mm x 50 mm
Max 330mm x 330mm (Optional 510mm x 510mm)
Board Thickness 0.4 ~ 7mm
Warpage±3 mm
Board Clearance Top/Bottom 50mm
Inspection Speed 20 cm²/ sec (Speed dependant on chosen resolution)
Gantry System Linear Motor
Lighting System RGB 3D Stroboscopic + Top Lighting

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